The high and low temperature test chamber is an instrument and equipment suitable for testing the reliability and performance indicators of product components and materials under high and low temperature (alternating) cyclic changes. At high temperatures, it can test the possibility of softening, efficiency reduction, characteristic changes, and potential damage of product components and materials Oxidation and other phenomena (such as softening or melting of fillers and sealing strips, decreased stability of electronic circuits, insulation damage, accelerated aging of polymer materials and insulation materials, etc.); At low temperatures, product parts and materials may experience cracking, embrittlement, jamming of movable parts, and changes in characteristics (such as material hardening and embrittlement, changes in electronic component performance, water condensation and freezing, and mechanical structural changes caused by material shrinkage).

Features

Innovative Technology: Independently developed control system with refrigeration PID control and high-speed processing capabilities, to control small refrigeration capacity and achieve energy-saving effect;

Energy saving: The maximum high temperature electricity consumption is as low as 0.2kw/H · low temperature 0.7kW/H;

Efficient and energy-saving: equipped with newly developed intelligent research and development (refrigeration and dehumidification) systems, it can achieve energy conservation and high reliability;

Rate selection: The temperature change rate can reach 3C/min, 5C/min, 10 ° C/min, 15C/min, 20C/min, 25 ° C/min;

High Mute: The operating volume can reach 65dB, meeting the extreme silence standard for low-temperature operation for 1000 hours without frost technology applications;

Intelligent monitoring: It can perform remote monitoring and control, transfer data from USB memory, and provide alarm reminders when errors occur.

Customized production: can meet customized needs such as door specifications, refrigeration methods, water supply, and language selection;

Test standard

GB/T 11158-2008 Technical Conditions for High Temperature Test Chambers;

GB/T 10589-2008 Technical Conditions for Low Temperature Test Chambers;

GB/T 10592-2008 Technical Conditions for High and Low Temperature Test Chambers;

GB/T2423.1-2008 Test A: Low temperature test method;

GB/T2423.2-2008 Test B: High temperature test method;

GB/T2423.22-2002 Test Method for Temperature Changes;

IEC 60068-2-1:2007 Low temperature test chamber test methods;

IEC 60068-2-2:2007 High temperature test chamber test methods;

GJB 150.3 High temperature test; GJB 150.4 Low temperature test;

IEC 68-2-1 Test A: Cold; IEC 68-2-2 Test B: Dry heat;

IS 016750; GB/T 13543; GB/T 13543;

Temperature tests in JESD 22 and other series of standards;

Specifications

For more detailed parameters, please contact us!